Magnetron sputtering is a physical vapor deposition (Physical Vapor Deposition, PVD) a. The general sputtering method can be used to prepare metals, semiconductors, insulators and other materials, and has the advantages of simple equipment, easy control, coating area and adhesion advantages, and the magnetron sputtering method developed in the 1970s Is to achieve a high speed, low temperature, low damage. Because it is high-speed sputtering at low pressure, it is necessary to effectively increase the gas ionization rate. Magnetron sputtering increases the plasma density by introducing a magnetic field at the target cathode surface that utilizes the magnetic field confinement of charged particles to increase the sputtering rate.
The coated target is sputtered on the substrate by magnetron sputtering under appropriate process conditions to form a sputtering source of various functional films.Common targets are: titanium target, chromium target, zirconium target, titanium aluminum target and so on。