Sputtering targets are more demanding than traditional materials

- May 31, 2019-

Firstly, the sputtering target is a critical consumable required for vacuum magnetron sputtering (PVD) coating.

Sputtering targets are more demanding than traditional materials. General requirements such as: size, flatness, purity, impurity content, density, N/O/C/S, grain size and defect control; higher requirements or special Requirements include: surface roughness, resistance, grain size uniformity, composition and tissue uniformity, foreign matter (oxide) content and size, magnetic permeability, ultra-high density and ultra-fine grains. Magnetron sputtering coating is a new type of physical vapor deposition method, which uses an electron gun system to emit and focus electrons on the material to be plated, so that the sputtered atoms follow the momentum conversion principle to remove the material with higher kinetic energy. Fly to the substrate to deposit a film. This plated material is called a sputtering target.

The above is what is the introduction of the sputtering target, then we know what is the sputtering target and then look at its material classification.

Secondly, the sputtering target material classification

There are three types of sputtering target materials: metal target, ceramic target, and alloy target.

Thirdly, sputtering target application field

Sputtering targets are mainly used in electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devices, etc.; they can also be used in the field of glass coating; they can also be applied to wear-resistant materials, high temperature corrosion resistance. , high-end decorative supplies and other industries.