Titanium target application
The target is the target material for high-speed energy-energy particle bombardment. There are metals, alloys, oxides, and the like. Different film materials (such as aluminum, copper, stainless steel, titanium, nickel target, etc.) can be obtained to obtain different film systems (such as super hard, wear-resistant, anti-corrosion alloy film, etc.).
(1) Metal target: nickel target, Ni, titanium target, Ti, zinc target, Zn, chromium target, Cr, magnesium target, Mg, germanium target, Nb, tin target, Sn, aluminum target, Al, indium target, In, iron target, Fe, zirconium aluminum target, ZrAl, titanium aluminum target, TiAl, zirconium target, Zr, aluminum silicon target, AlSi, silicon target, Si, copper target Cu, tantalum target T, a, tantalum target, Ge, Silver target, Ag, cobalt target, Co, gold target, Au, germanium target, Gd, germanium target, La, germanium target, Y, germanium target, Ce, tungsten target, w, stainless steel target, nickel chromium target, NiCr, germanium Target, Hf, molybdenum target, Mo, iron-nickel target, FeNi, tungsten target, W, and the like.
(2) Ceramic target: ITO target, magnesium oxide target, iron oxide target, silicon nitride target, silicon carbide target, titanium nitride target, chromium oxide target, zinc oxide target, zinc sulfide target, silicon dioxide target, a silicon oxide target, a ruthenium oxide target, a zirconium dioxide target, a ruthenium pentoxide target, a titania target, a zirconium dioxide target, a ruthenium dioxide target, a titanium diboride target, a zirconium diboride target, a tungsten trioxide target, Aluminum oxide target bismuth pentoxide, bismuth pentoxide target, magnesium fluoride target, cesium fluoride target, zinc selenide target, aluminum nitride target, silicon nitride target, boron nitride target, titanium nitride target , a silicon carbide target, a lithium niobate target, a barium titanate target, a barium titanate target, a barium titanate target, a nickel oxide target, a sputtering target, and the like.
2. Main performance requirements of the target
Purity is one of the main performance indicators of the target, because the purity of the target has a great influence on the performance of the film. However, in practical applications, the purity requirements of the target are not the same. For example, with the rapid development of the microelectronics industry, the silicon wafer size has been developed from 6”, 8” to 12”, and the wiring width has been reduced from 0.5um to 0.25um, 0.18um or even 0.13um, and the previous 99.995% target purity. It can meet the process requirements of 0.35umIC, while the preparation of 0.18um line requires 99.999% or even 99.9999% for target purity.
(2) Impurity content
Impurities in the target solids and oxygen and moisture in the pores are the main sources of contamination of the deposited film. Targets for different applications have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets for the semiconductor industry have special requirements for alkali metal content and radioactive element content.
In order to reduce pores in the solids of the target and improve the properties of the sputtered film, the target is usually required to have a higher density. The density of the target not only affects the sputtering rate, but also affects the electrical and optical properties of the film. The higher the target density, the better the performance of the film. In addition, increasing the density and strength of the target allows the target to better withstand the thermal stresses during sputtering. Density is also one of the key performance indicators of the target.
(4) Grain size and grain size distribution
Typically the target is a polycrystalline structure with a grain size on the order of microns to millimeters. For the same target, the sputtering rate of the fine-grained target is faster than that of the coarse-grained target; and the thickness of the target sputter-deposited film with a smaller difference in grain size (distributed uniformly) is more uniform. .
TA0, TA1, TA2, TA9, TA10, ZR2, ZR0, GR5, GR2, GR1, TC11, TC6, TC4, TC3, TC2, TC1
Widely used in decorative coatings, wear-resistant coatings, electronic industry CD, VCD and other types of optical discs and a variety of disk coating.
The tungsten-titanium (W-Ti) film and the tungsten-titanium (W-Ti)-based alloy film are high-temperature alloy films with a series of irreplaceable excellent properties. Tungsten has high melting point, high strength and low coefficient of thermal expansion. W/Ti alloy has low electrical resistivity, good thermal stability and oxidation resistance. Metal wirings that require electrical conduction, such as Al, Cu, and Ag, have been widely used and studied. However, the wiring metal itself is easily oxidized, easily reacts with the surrounding environment, has poor adhesion to the dielectric layer, easily diffuses into the substrate material of devices such as Si and SiO2, and forms metal and Si at a lower temperature. The compound, acting as an impurity, drastically degrades the performance of the device. W-Ti alloys are easy to use as wiring diffusion barriers due to their stable thermomechanical properties, low electron mobility, high corrosion resistance and chemical stability, especially for high current and high temperature environments. .
5. Development prospects
Tungsten-titanium targets have recently been developed as photovoltaic cell coating materials, and are the best choice as barriers for third-generation solar cells.
Due to the excellent performance of W-Ti series films, the application volume has increased sharply in recent years. In 2008, the world consumption of W-Ti targets has reached 400t. With the development of photovoltaic industry, the demand for such targets will increase. The bigger. According to the industry, there is a big increase in its usage. The international solar cell market is growing at a rate of 100%. Currently, many companies in the world are participating in the further development of the solar market and have already entered the market, such as Wverthsurlfulcell in Germany, Global solar Energy in the US, Honda showa Solar shell in Japan, Hitachi Metals. Company, etc.
The ultra-large size, high-density, high-purity W-Ti target developed in China is a new type of ion sputter coating target material. It can be widely used in the barrier layer or toning layer of the display screen, the decorative layer of the notebook computer, the packaging of the battery, and the barrier layer of the solar (photovoltaic) battery, which has good market prospect and economic benefit. On the other hand, it can drive the upgrading of China's tungsten industry products and obtain higher added value.