Coated targets are sputter sources that sputter various functional films on substrates by magnetron sputtering, multi-arc ion plating, or other types of coating systems under appropriate process conditions. In short, the target material is high-speed charge particle bombardment of the target material for high-energy laser weapons, different power density, different output waveforms, different wavelengths of laser interaction with different targets will produce different destruction damage effect. For example: evaporation magnetron sputtering coating is heated evaporation coating, aluminum film. Change the different targets (such as aluminum, copper, stainless steel, titanium, nickel target, etc.), you can get a different film system (such as superhard, wear-resistant, corrosion-resistant alloy film, etc.).
Material classification: metal target, ceramic target, alloy target
Magnetron sputtering target
1) magnetron sputtering principle:
A perpendicular magnetic field and an electric field are applied between the sputtered target (cathode) and the anode to fill the high-vacuum chamber with the required inert gas (typically, Ar gas). The permanent magnet forms 250 to 350 Gaussian magnetic field, with high-voltage electric field composed of orthogonal electromagnetic field. Under the action of an electric field, Ar gas is ionized into positive ions and electrons, and a certain negative high voltage is applied to the target. Electrons emitted from the target are affected by the magnetic field and the ionization probability of the working gas increases. A high-density plasma is formed near the cathode The Ar ions accelerate to the target under the Lorentz force and bombard the target at a high velocity so that the atoms sputtered by the target follow the principle of momentum conversion and move away from the target with higher kinetic energy Substrate deposition film. Magnetron sputtering is generally divided into two types: DC sputtering and RF sputtering, in which the principle of DC sputtering equipment is simple, the speed of sputtering metal, the rate is also fast. The use of radio frequency sputtering is more widely used. In addition to sputtering conductive materials, it can also sputter non-conductive materials, and can also be prepared by reactive sputtering of oxides, nitrides and carbides and other compound materials. If the RF frequency increases after microwave plasma sputtering, now commonly used electron cyclotron resonance (ECR) microwave plasma sputtering.
2) magnetron sputtering target species:
Metal Sputtering Coating Target, Alloy Sputtering Coating Target, Ceramic Sputtering Coating Target, Boride Ceramic Sputtering Target, Carbide Ceramic Sputtering Target, Fluoride Ceramic Sputtering Target, Nitride Ceramic Sputtering Target, oxide ceramic target, selenide ceramic sputtering target, silicide ceramic sputtering target, sulfide ceramic sputtering target, telluride ceramic sputtering target, other ceramic target, chromium-doped mono-oxide Silicon ceramic target (Cr-SiO), indium phosphide target (InP), lead arsenic target (PbAs), indium arsenide target (InAs).