What is a sputtering target?
Magnetron sputtering coating is a new type of physical vapor deposition method, which uses an electron gun system to emit and focus electrons on the material to be plated, so that the sputtered atoms follow the momentum conversion principle to remove the material with higher kinetic energy. Fly to the substrate to deposit a film. The material to be plated is called a sputtering target.
Production and craft of Target
Sputtering is one of the main techniques for preparing thin film materials. It uses ions generated by an ion source to accelerate and aggregate in a vacuum to form a high-speed energy ion beam, bombarding a solid surface, and kinetic energy exchange between ions and solid surface atoms. The atoms on the solid surface are separated from the solid and deposited on the surface of the substrate. The bombarded solid is a raw material for depositing a thin film by sputtering, which is called a sputtering target. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits, recording media, flat displays, and surface coatings of workpieces. The high temperature and high vacuum environment inside the process chamber allows these metal atoms to form crystal grains, which are then patterned and etched by lithography, and finally a layer of metal wires, and the data transmission of the chip depends on these metal wires.
application of Target
Sputtering targets are mainly used in electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devices, etc.; they can also be used in the field of glass coating; they can also be applied to wear-resistant materials, high temperature corrosion resistance. , high-end decorative supplies and other industries.