General Situation Of Application Of Titanium Sputtering Targets In Integrated Circuits In China

- Feb 21, 2019 -

General Situation of Application of Titanium Sputtering Targets in Integrated Circuits in China

The purity of integrated circuit Ti targets is mainly greater than 99.995%, and currently relies mainly on imports. In 2013, China's IC industry achieved sales revenue of 250.8 billion yuan and imports amounted to 231.3 billion US dollars, making it the largest imported commodity in China for the first time. In 2014, the sales revenue of the integrated circuit industry was 267.2 billion yuan, and the import volume still reached 217.6 billion US dollars. Targets for integrated circuits account for a large share of the global target market.

 Ti target raw materials: High-purity Ti production is mainly concentrated in the United States, Japan and other countries, such as the United States Honeywell, Japan's Toho, Japan's Osaka titanium industry; domestic start late, after 2010 Beijing Nonferrous Metal Research Institute, Zunyi Titanium, Ningbo Chuangrun and others have successively launched domestically produced high-purity Ti products, but the stability of the products has yet to be improved.

 Structural development of Ti target: The early chip foundry has a large profit margin, mainly using a 100-150mm magnetron sputtering machine, and the power is small, the sputtering film is thick, the chip size is large, and the performance of the single target is large. It can meet the requirements of the use of the machine at that time. At that time, the Ti target for integrated circuits was mainly 100-150mm monomer and combined target, such as the typical 3180 type and 3290 type target. In the second stage, according to Moore's Law, the chip line width is narrowed. The chip foundry mainly uses a 150-200mm sputtering machine. In order to increase the profit margin, the sputtering power of the machine is increased, which requires the target size to increase. At the same time, it maintains high thermal conductivity, low price and certain strength. In this period, the Ti target is mainly composed of aluminum alloy back plate diffusion welding and copper alloy back plate brazing and welding, such as typical TN, TTN type, Endura 5500 type and other targets. . In the third stage, with the development of integrated circuits, the chip line width is further narrowed. At this time, the chip foundry mainly uses a 200-300mm sputtering machine. In order to further increase the profit margin, the sputtering power of the machine is increased, which requires the target. The size is increased while maintaining high thermal conductivity and sufficient strength. In this period, the Ti target is mainly made of copper alloy back plate diffusion welding, such as the mainstream SIP type target.

 Ti target processing and manufacturing: The early domestic and international markets were basically monopolized by large target manufacturers such as the United States and Japan. After 2000, the domestic manufacturing industry gradually entered the target market, and began to import high-purity Ti raw materials to process low-end targets. In recent years, domestic Ti target manufacturers have developed rapidly, and their market share has gradually expanded to Taiwan, Europe and the United States. For example, there are two companies, namely Yanyijin and Jiangfeng Electronics, which have focused on target manufacturing for many years. Domestic target manufacturing companies are also working with domestic magnetron sputtering machine manufacturers to develop targets to promote the development of the domestic integrated circuit magnetron sputtering industry.